| CAS Number | 7440-50-8 |
| Catalog Description | Copper foil, 0.25mm thick, 99.9999% trace metals basis |
| MDL Number | MFCD00010965 |
| Master Molecular formula | Cu |
| Molecular formula | Cu |
| Melting point in C | 1083.4° |
| Boiling point in C | 2567° |
| EC Number | 231-159-6 |
| Shipping | Non-hazardous for shipping |
| CAS Number | 7440-50-8 |
| TSCA | Yes |
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